Syringe Tin Solder Paste

Features

SMART DESIGN

New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.Adapted to the mobile phone repair industry, computer digital service industries and high-presicion circuit board soldering SMT/BGA soldering processes.

PCB/BGA DEDICATED

High-end quality, a unique formula, perfect performance, easy to weld, solder joint is bright and full, no weld, false welding phenomenon.

WIDELY APPLICABLE

The residue is colorless and transparent, does not affect t he detection, disposable and excellent cleaning performance. Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern.

REVOLUTIONARY DURABILITY

Wetting, anti-dry, relatively long shelf life at room temperature. Unique high-quality solder paste, fine and flexible packaging (10 cc/support), delicate appearance.

Preservation method:

The solder paste should be kept at 1-10℃.
Before the opening, the temperature of the solder paste should be raised to the ambient temperature (25℃), and the temperature return time should be about 3-4 hours.
The solder paste should be used for 6 months.
The solder paste should not be placed in the sun.

Precautions:

Use only with adequate Ventilation.
The solder paste contains organic solvent. Avoid repeated contact with skin. If the solder paste gets on your skin, wipe it off with alcohol and rinse thoroughly with water.
Avoid contacting with eyes.
Keep away from children.

Specifications: